STVision has its roots in image processing since 1979. We have developed our own software standard, with special focus on industrial vision and optical measurement since 1989.
All our algorithms and tools had to prove its reliability and precision in the rough production environment and we could improve through generations of computer and software standards: Windows 2000 based systems.
Our systems had to pass severe production acceptance tests, most of them are still in production today and are used to assure the quality of parts in electronic watches, microprocessors, mobile phones, smart cards, ABS break systems for cars, precision writing instruments and many more.
Here is a brief history overview:
1990 Dispense measurement, die and wire bond inspection Diode inspection Lead inspection for power devices Inspex Motion (elongation measurement) 1992 Leadframe inspection 1993 Package inspection 1994 Inspex LF including automatic handling system and 3 high resolution 1995 LF3 new generation of leadframe inspection systems LF/TAPE application for Kepton tape inspection Package inspection for SOD and SOTxx 1996 DPAK lead coplanarity measurement 1997 SOD 75 & 79 lead coplanarity and wiring inspection 1998 Hit over 30 000 components/hour lead molding 1999 Ball grid array inspection. Patented 3D height measurement 2000 MLP Inspection & Vision 3 software (new generation) All application is based on the new 2000 software. 2001 Inspection of inkjet nozzles for printer. 2002 Laser marking and deflashing systems. Camera calibrated laser systems. 2003 DCS1F Dispense Check on flip bonders. ENC inspection of encoder discs for automotive power steering. 2004 CCD inspection of imaging devices. 2005 2nd generation of high-speed inkjet nozzle inspection. Dispenser station for controlled dispensing of micro volume. 2006 Wire Bond Inspection system for thick Alu wedge bonds. 2007 New imaging sensor inspection for BlueRay DVD Devices. 2008 Fluorescence analysis system for detection of mold residues solar concentrator tracker with sun position sensor 2009 New generation of gel contamination on mold surface Solar Cell edge inspection (SCE) system 2010 Inspection modules to be integrated into older generation systemation handlers for the semiconductor industry 2011 Systems for metal surface and contour metal sheets 2012 Inspection area system for metal sheets (540x540mm) 2013 High speed inspection system for optical density and position measurement of thin film material. participation in a BMFT project for next generation high definition rotary encoder inspection
